收藏本站
NTMD2C02R2
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 26 shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems, but it is a good starting point. Factors
that can affect the profile include the type of soldering
system in use, density and types of components on the
board, type of solder used, and the type of board or
substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density
board. The Vitronics SMD310 convection/infrared reflow
soldering system was used to generate this profile. The type
of solder used was 62/36/2 Tin Lead Silver with a melting
point between 177 ? 189 ° C. When this type of furnace is
used for solder reflow work, the circuit boards and solder
joints tend to heat first. The components on the board are
then heated by conduction. The circuit board, because it has
a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may
be up to 30 degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
STEP 2
VENT
STEP 3
HEATING
STEP 4
HEATING
STEP 5
HEATING
STEP 6
VENT
STEP 7
COOLING
ZONE 1
“SOAK” ZONES 2 & 5
ZONES 3 & 6
ZONES 4 & 7
200 ° C
“RAMP” “RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150 ° C
“SOAK”
160 ° C
“SPIKE”
170 ° C
205 ° TO 219 ° C
PEAK AT
SOLDER
JOINT
150 ° C
SOLDER IS LIQUID FOR
100 ° C
100 ° C
140 ° C
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
5 ° C
TIME (3 TO 7 MINUTES TOTAL)
Figure 26. Typical Solder Heating Profile
http://onsemi.com
11
T MAX
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
NTMD2P01R2G MOSFET PWR P-CHAN DUAL 16V 8SOIC
NTMD4184PFR2G MOSFET P-CH 30V 2.3A 8-SOIC
NTMD4820NR2G MOSFET N-CH DUAL 30V 4.9A 8-SOIC
NTMD4840NR2G MOSFET N-CH DUAL 30V 4.5A 8-SOIC
NTMD4884NFR2G MOSFET N-CH 30V 3.3A 8-SOIC
NTMD5836NLR2G MOSFET N-CH 40V 11A SO-8FL
NTMD5838NLR2G MOSFET N-CH 40V 8.9A 8SOIC
NTMD6N02R2 MOSFET PWR N-CH DL 3.92A 20V 8SO
相关代理商/技术参数
NTMD2P01R2 功能描述:MOSFET -16V 2.3A Dual RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTMD2P01R2G 功能描述:MOSFET -16V 2.3A Dual P-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTMD3N08 制造商:未知厂家 制造商全称:未知厂家 功能描述:TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 80V V(BR)DSS | SO
NTMD3N08/D 制造商:未知厂家 制造商全称:未知厂家 功能描述:80 V Power MOSFET
NTMD3N08L 制造商:未知厂家 制造商全称:未知厂家 功能描述:TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 80V V(BR)DSS | SO
NTMD3N08LR2 功能描述:MOSFET 80V 2.3A N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTMD3N08LR2G 制造商:ON Semiconductor 功能描述:
NTMD3P03R2 功能描述:MOSFET 30V 3.05A P-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube